| 
															
															What is Parylene? 
															
															Parylene is the 
															generic name for the 
															poly-para-xylylenes. 
															These materials form 
															linear, 
															highly-crystalline 
															polymers but can be 
															usefully produced 
															only as coatings and 
															films. The most 
															commonly used is 
															Parylene C, the 
															mono-chloro 
															substituted 
															compound. Parylene 
															N, the 
															un-substituted 
															compound, has better 
															high-frequency 
															dielectric 
															properties, better 
															penetrating power 
															for coating the bore 
															of very small 
															diameter tubes, and 
															is often preferred 
															in medical 
															applications. 
															Parylene D, the 
															di-chloro-substituted 
															compound, has better 
															high temperature 
															endurance. |  |  
 
 
  
 
 
  
 
 
  
 
 
 
  
 
 
 
  | 
														
															| 
															 
															 |  | 
														
															| 
															
															The Parylene Coating 
															Process 
															
															
															The Parylene process 
															is unique in coating 
															technology and is 
															best described as a 
															vapor deposition 
															polymerization. It 
															is carried out under 
															vacuum and requires 
															specialized 
															equipment. 
																
																
																The process 
																begins with 
																sublimation at 
																about 150°C of 
																the high purity 
																crystalline 
																dimer 
																di-p-xylylene.
																
																
																The vapor is 
																pyrolised at 
																about 650°C to 
																form the gaseous 
																monomer which 
																has an olefinic 
																structure.
																
																
																The coating 
																chamber is at 
																room 
																temperature. The 
																vapor condenses 
																on all surfaces 
																equally and can 
																pass through 
																holes as small 
																as 1μ. It then 
																spontaneously 
																polymerizes to 
																form a product 
																with a high 
																degree of 
																crystallinity. 
																The coating is 
																absolutely 
																conformal and 
																can be laid down 
																in thicknesses 
																from a few 
																angstroms to 50 
																microns or more 
																depending on the 
																requirements of 
																the end use.
																 |  | 
														
															|  |  | 
														
															| 
															
															Parylene is applied 
															at room temperature 
															with specialized 
															vacuum deposition 
															equipment that 
															permits control of 
															coating rate and 
															thickness. The 
															deposition process 
															takes place at the 
															molecular level as 
															the chemical, in 
															dimer form, is 
															converted under 
															vacuum and heat to 
															dimeric gas; 
															pyrolized to cleave 
															the dimer; and 
															finally deposited as 
															a clear polymer 
															film.  
															
															The material is 
															applied at .0002-in 
															per hr. Coating 
															thicknesses from 
															.100 to 76 microns 
															can be applied in a 
															single operation. 
															Typical coating 
															thickness for 
															circuit boards is 
															.00 I-in. 
															 |  | 
														
															|  |  | 
														
															| Because it is a 
															gaseous process 
															every surface is 
															coated identically 
															unless masked to 
															prior specification. 
															It is perfectly 
															uniform over and 
															inside of all 
															surfaces. No other 
															process can make 
															this claim. |  | 
														
															| 
															
															
															Parylene General
															
															
															
															Properties Benefits 
																
																
																
																MIL-I-46058C, 
																Type XY approved
																
																
																FDA approved 
																--USP XXII, 
																Class VI 
																bio-compatibility 
																rating 
																
																
																UL listed 
																
																
																Completely 
																pin-hole free 
																barrier coating
																
																
																Fully conformal 
																on any type of 
																surface material 
																or design 
																
																
																Inert 
																transparent 
																polymer 
																
																
																Meets NBC 
																requirements 
																(ARlO / AFR80-38 
																/ Navinst 
																3400.2) 
																
																
																Barrier to 
																oxygen, 
																moisture, 
																chemicals, 
																solvents, and 
																carbon dioxide
																
																
																Thermal 
																mechanically 
																stable between 
																-200°C and 150°C
																
																
																Extremely high 
																dielectric 5,000 
																volts per 0.001" 
																minimum 
																
																
																Excellent 
																adhesion 
																properties
																
																
																Low stress 
																coating that 
																does not form 
																sites prone to 
																crack initiation
																
																
																Low / minimal 
																impact on 
																package cooling
																
																
																Hydrophobic
																
																
																Barrier to ionic 
																and moisture 
																species 
																
																
																Chemical and 
																fungal 
																resistance
																
																
																Non-contaminating 
																coating and 
																coating process 
																--no solvents, 
																catalysts or 
																other 
																by-products are 
																introduced 
																during coating
																
																
																Entire process 
																is accomplished
																 |  |