Parylene Variants


Parylene Engineering offers two commercial Parylene variants, each having its own unique electrical and physical properties. Contact the Para Tech engineering department for assistance with material selection as well as determination of film thickness and substrate preparation requirements.
   
Parylene C
 
Differs chemically, having a chlorine atom on the benzene ring that results in a useful combination of electrical and physical properties including particularly low moisture and gas permeability. This version deposits on substrates faster is than Parylene N, with a consequent reduction in crevice penetration activity.  

Parylene N

Has the highest dielectric strength of the three versions, and a dielectric constant value independent of frequency. It is able to penetrate crevices more effectively than the other two versions because of the higher level of molecular activity that occurs during deposition. Parylene N is commonly used in high frequency applications because of its low dissipation factor and dielectric constant values.

Parylene D
 
Maintains its physical strength and electrical properties at higher temperatures.