Parylene
Engineering
offers two
commercial
Parylene
variants,
each having
its own
unique
electrical
and physical
properties.
Contact
Parylene Engineering
for
assistance
with
material
selection as
well as
determination
of film
thickness
and
substrate
preparation
requirements.
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Parylene
C
D iffers
chemically,
having a
chlorine
atom on
the
benzene
ring
that
results
in a
useful
combination
of
electrical
and
physical
properties
including
particularly
low
moisture
and gas
permeability.
This
version
deposits
on
substrates
faster
is than
Parylene
N, with
a
consequent
reduction
in
crevice
penetration
activity.
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Parylene
N
Has the
highest
dielectric
strength of
the three
versions,
and a
dielectric
constant
value
independent
of
frequency.
It is able
to penetrate
crevices
more
effectively
than the
other two
versions
because of
the higher
level of
molecular
activity
that occurs
during
deposition.
Parylene N
is commonly
used in high
frequency
applications
because of
its low
dissipation
factor and
dielectric
constant
values.
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Parylene
D
Maintains
its
physical
strength
and
electrical
properties
at
higher
temperatures.
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