History of Parylene - Parylene Engineering

Parylene development started in 1947, when Michael Szwarc discovered the polymer as one of the thermal decomposition products of a common solvent p-xylene at a temperature between 700 and 900 °C. Szwarc first postulated the monomer to be para-xylylene which he confirmed by reacting the vapors with iodine and observing the para-xylylene di-iodide as the only product. The reaction yield was only a few percent, and a more efficient route was found later by William F. Gorham at Union Carbide. He deposited parylene films by the thermal decomposition of di-p-xylylene at 550 °C and in vacuum below 1 Torr. This process did not require a solvent and resulted in chemically resistant films free from pinholes. Union Carbide commercialized a parylene coating system in 1965.
Parylene is widely used for:
  • Abrasion protection
  • Aerospace and Aviation Electronics
  • Barrier layers
  • Corrosion protection for metallic surfaces
  • Electronic Components
  • Glass
  • Hydrophobic coating
  • LEDS
  • Medical Devices and Instruments
  • MEMS
  • Microwave electronics
  • Military and Defense Parts
  • Nanotech
  • Protection of plastic, rubber
  • Rare Earth Magnets
  • Reduction of friction
  • Reinforcement of micro-structures
  • Semiconductor Products
  • Sensors in rough environment
  • Silicone Gaskets
  • Wire and Cable
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  TYPICAL MARKETS FOR PARYLENE FILM
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arrow04   Parylene for the Aerospace and Aviation Industries
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arrow04   Parylene for the Automotive Industry
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arrow04   Parylene for the Defense
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arrow04   Parylene for Electronics
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arrow04   Parylene for LEDS
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arrow04   Parylene for the Medial Fields
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